• Title: Semiconductor Packaging: Materials Interaction and Reliability
• Author(s) Andrea Chen, Randy Hsiao-Yu Lo
• Publisher: CRC Press; 1st edition (April 10, 2017); eBook (Creative Commons Licensed)
• License(s): Creative Commons License (CC)
• Paperback: 216 pages
• eBook: PDF and Read Online
• Language: English
• ISBN-10: 113807540X
• ISBN-13: 978-1138075405
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Book Description

The book focuses on an important step in semiconductor manufacturing - package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance.

• Andrea Chen is a technical marketing manager at Siliconware USA, Inc. She previously worked in the Technology Development group at ChipPAC, Inc. and in the Package Technology group at National Semiconductor Corporation. She has coauthored more than 30 papers and presentations.

• Amazon

• Electronic Engineering
• Microcontrollers, PLC, VLSI, etc.
• Embedded Systems
• Electrical and Computer Engineering

• Semiconductor Packaging: Materials Interaction and Reliability (Andrea Chen, et al)
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